CelestialAI,astartupcompany,hasdevelopedanewinterconnectsolutionthatcombinesDDR5andHBMmemorytoimproveefficiencybetweenchips.ItisspeculatedthatAMDmaybeoneofthefirstmanufacturerstoadoptthissolution.
AccordingtoCelestialAI'sdescription,theirtechnologyusesopticalphotonstocombineHBMandDDR5memoryintooneinterface.ThisallowsforstackinguptotwoHBMstacksandfourDDR5DIMMs,resultinginamaximummemorycapacityof72GB+2TB.Thefirstgenerationtechnologycanachieveaspeedof1.8Tb/spersquaremillimeter,whilethesecondgenerationcanincreasethisfigurebyfourtimes.
DaveLazovsky,co-founderofCelestialAI,statedthattheirphoton-basedinterconnecthasreceivedsignificantinterestfrompotentialcustomers.Thecompanyhasalreadyraised$$175million(approximatelyRMB1.26billion)initsfirstroundoffunding,andhasalsoreceivedsupportfromcompanieslikeAMD.
Thisinnovativeapproachoffersanopportunityforimprovedperformanceindata-intensiveapplicationsandwilllikelyleadtoincreasedcompetitionamongchipmanufacturerswhoseektointegratesuchtechnologiesintotheirproducts.
